HEICO Corporation (HEI) will raise its semi-annual dividend to $0.08 per share. The cash dividend is payable on July 19, 2017 to shareholders of record as of July 5, 2017.

The upcoming cash dividend is HEICO's 78(th) consecutive semi-annual cash dividend since 1979 and represents an 11% increase over the prior semi-annual per share amount of $0.072 (as adjusted for the Company's 5-for-4 stock split distributed in April 2017). Additionally, HEICO increased its cash dividend by 13% in December 2016.

Laurans A. Mendelson, HEICO's Chairman and Chief Executive Officer, along with HEICO's Co-Presidents, Eric A. Mendelson and Victor H. Mendelson, stated, "The cash dividend increase represents our Board of Directors' commitment to rewarding shareholders, while also retaining sufficient capital to invest in our internal growth objectives and acquisition strategies."

HEICO Corporation is engaged primarily in the design, production, servicing and distribution of products and services to certain niche segments of the aviation, defense, space, medical, telecommunications and electronics industries through its Hollywood, Florida-based Flight Support Group and its Miami, Florida-based Electronic Technologies Group.